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Our Universal BGA Reball Tool is capable of repairing
BGA components by reapplying uniform solder balls to the components. The
patent-pending process is simple and straightforward.
(Click on the image to see a larger version.)
The BGA Reball Tool is designed for low cost BGA repair and is configurable to
handle a variety of BGA sizes. The tool consists of 2 main components. The
first is the adjustable lower fixture designed to hold a variety of BGA
devices. The second is the upper fixture designed to dispense solder balls of
the proper diameter in the desired grid pattern. The two fixtures are designed
to work together to deliver consistent results after the initial setup.
Customized fixtures are also available.
 Click
here to watch our training video and see it for yourself! |
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Solder sphere pre-forms (Average:$10/ea)
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Minimum order 25 pre-forms (Average:$250)
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Lead time from 1 to 3 wks
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Alignment fixture required for each part type
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Lengthy removal of pre-form paper
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Will require a secondary reflow to reshape solder back to spherical shape
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Requires lengthier cleaning process to ensure that paper debris is not left
behind
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No pre-forms required (Average solder sphere less than $1 for each BGA)
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No minimum order required
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No lead time required
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No individualized fixture required - universal fixture
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No lengthy removal of pre-form paper
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Will not require secondary reflow to reshape solder sphere
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Will not require lengthier cleaning process to ensure paper debris is not left
behind
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Click
here to watch our training video and see it for yourself!
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Contact
us now for more information.
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